Chiplet Multi-Objective Optimization Algorithm Based on Communication Consumption and Temperature

A chiplet multi-objective optimization algorithm for 2.5-D integrated circuit (IC) based on a passive interposer is discussed in this article. Inspired by the network-on-chip mapping problem, we propose novel algorithm, called optimization, which minimizes average temperature and communication consumption between chiplets at same time. The considers specificities of IC chiplets, such as spacing different sizes chiplets. In addition to weight factor, α also introduced make balance consumption. designer can change factor according their own requirement. multi-window display system used an example article demonstrate algorithm’s efficiency accuracy. According our most ideal solution be reduced 8.34 K 232.13 μJ.